Sulfur-Free Packaging Paper for Semiconductor Chips

Sulfur-Free Packaging Paper for Semiconductor Chips
Sulfur-Free Packaging Paper for Semiconductor Chips
Sulfur-Free Packaging Paper for Semiconductor Chips
Sulfur-Free Packaging Paper for Semiconductor Chips

Sulfur-Free Packaging Paper for Semiconductor Chips

  • Basis weight: 30–80 gsm

  • Color: White / Natural

  • pH: Neutral

  • Sulfur content: <0.1% or lower

  • Dust level: Ultra-low

  • Packaging form: Roll / Sheet

  • Customizable: Specifications can be tailored according to end-user requirements

Share:
Description

Sulfur-Free Packaging Paper for Semiconductor Chips is a high-cleanliness industrial packaging material designed for IC chips, wafers, package substrates, and other sensitive electronic components. Its core feature is the absence of free sulfur or sulfides, preventing sulfur from reacting with metal electrodes (such as copper, silver, and aluminum), thus avoiding corrosion, sulfide tarnishing, and performance degradation.

✅ Main Functions

Prevent Metal Corrosion / Sulfuration

Chip terminals and pads often contain copper, silver, or aluminum. Sulfur-free paper helps prevent sulfide reactions that cause blackening and poor contact.

Isolation Protection

Physically isolates external moisture, particles, and contaminants.

Clean Packaging

Reduces micro-dust and fiber shedding to meet high-purity requirements.

Storage & Transportation Protection

Protects chip surfaces during handling, transfer, transportation, and warehousing.

✅ Why Must Semiconductors Use Sulfur-Free Packaging Paper?

Chip electrodes and pads are highly sensitive to sulfur.
Ordinary paper contains sulfur, which reacts with copper or silver → forms sulfides → leading to:

❌ Terminal blackening
❌ Reduced solderability → poor solder joints
❌ Electrical instability
❌ Shortened lifespan
❌ High failure risk

Therefore, semiconductor packaging must use sulfur-free paper with extremely low sulfur content to ensure reliability.

✅ Key Features

Feature Description
Sulfur-free composition <0.1% or lower per industry requirements
High cleanliness Low dust / low fiber shedding
Chemical stability No chemical reaction with metals
High-temperature resistance Can be used in FOL and other thermal processes
Low volatility Reduces gas-induced corrosion or contamination
Soft & wear-resistant Minimizes surface scratches

Why Choose Our Sulfur-Free Paper?

Strict Purity Control – Ultra-low sulfur content, safe for any semiconductor surface
High Cleanliness – Controlled fiber loss to prevent contamination
Enhanced Corrosion Protection – Eliminates oxidation and blackening issues
Flexible Manufacturing – Wide range of sizes and custom formats
Stable & Reliable Supply – Consistent quality with fast delivery

Our Sulfur-Free Paper is widely used in wafer fabs, OSAT factories, electronic assembly plants, and high-precision component manufacturing sectors.

Contact us now for samples, specifications, and pricing

Get in Touch

You will find yourself working in a true partnership that results in an incredible experience, and an end product that is the best.